Silicone catalyst Poisoning

Silicone catalyst Poisoning
Details:
There are a number of chemicals would cause addition type cured potting silicone "poisoning" When "A" component and "B" component are mixed, platinum curing agent will react and affect the curing reaction. Platinum becomes inactive upon contact with some chemicals. Once the hardener is inactivated or poisoned, the affected silicone area will never cure, meaning that the uncured area will remain fluid, adhesive.
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Description
Technical Parameters

Cause of platinum curing agent "poisoning"

There are a number of chemicals would cause addition type cured potting silicone "poisoning" . When "A" component and "B" component are mixed, platinum curing agent will react and affect the curing reaction. Platinum becomes inactive upon contact with some chemicals. Once the hardener is inactivated or poisoned, the affected silicone area will never cure, meaning that the uncured area will remain fluid, adhesive.

Curing "poisoning" is divided into different degrees. Affected areas range from not curing at all to a stick-slip state or sticky surface. The degree of "poisoning" is determined by the type and amount of chemicals what silicone contact with.

Here is a partial list of common materials known to cause"poisoning"  . Please note that this is not a complete list of all problem materials,for reference only.

The ingredients including

Amines and amino compounds

Neutralizing amine

Ethanol-amine, N-methamphetamine, triethanol amine 

N-dimethylethanol amine, n-butylamine, cyclohexylamine

Tripolycyanamide

Dimethyl formamide

Nit-riles,cyanate ester,oxime,nitro compounds,Hydra-zine compounds,azo compounds

Adipic dinitrile

Methyl ethyl ketoxime

Nitroso

Chelate

Ethylene Di-amine Tetra-acetic Acid(EDTA)

Nitrilotriacetic acid(NTA)

Composition of sulfur

Sulfide, a compound containing sulfur

1.Dimethyl disulfide(DMDS), Thioacetic acid,Allylthiourea

Tin composition

1. Fatty acid tin salts, such as those used in tin-cured silicone off- moulding coatings

Phosphorus composition 

Phosphorous compounds

1.Triphenylphosphine(TPP), Phosphite(TTFP),Triethyl phosphite

Containing arsenic, antimony, selenium, tellurium components Arsine,Stilbenes,Selenide,Telluride

1. Three phenyl arsonic,Triphenyl symmetric diphenyl ethylene

2. Chlorobenzene carboxymethyl selenide

Residual solvent or monomer 

A chlorinated hydrocarbon containing an amine stabilizer

Alcohols

1. Ethanol and methanol lipid

2. Ethyl acetate, vinyl acetate, unsaturated bond components

Substrate that may inhibit curing

Polyethylene with anti-slip, anti-oxidant or other ingredients listed above

The pigmented base coat contains any of the ingredients listed above

100% sodium chloride base coating, such as sodium alga acid orcarboxymethyl cellulose sodium. However, these salts used with

Hydroxyethyl cellulose do not cause curing "poisoning".

Clay coated adhesive using polyethylene acetate or acrylic latex as adhesive.

Coated adhesive contains calcium carbonate

Coated adhesive contains composition as bellow

1. Natural rubber latex/clay; Latex/ethyl starch

2.Styrene /acrylic

3.Polyvinyl acetate; Polyethylene acetate/acrylic acid


 

 

 

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